Findchips: Compare LFE2M50E-6FN900I vs LFE2M50SE-6F900I

LFE2M50E-6FN900I vs LFE2M50SE-6F900I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes	No
Rohs Code	Yes	No
Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	LATTICE SEMICONDUCTOR CORP	LATTICE SEMICONDUCTOR CORP
Part Package Code	BGA	BGA
Package Description	FPBGA-900	FPBGA-900
Pin Count	900	900
Reach Compliance Code	compliant	compliant
ECCN Code	3A991.D	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	357 MHz	357 MHz
Combinatorial Delay of a CLB-Max	0.331 ns	0.331 ns
JESD-30 Code	S-PBGA-B900	S-PBGA-B900
JESD-609 Code	e1	e0
Length	31 mm	31 mm
Moisture Sensitivity Level	3	3
Number of CLBs	6000
Number of Inputs	410	410
Number of Logic Cells	50000	50000
Number of Outputs	410	410
Number of Terminals	900	900
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	6000 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA900,30X30,40	BGA900,30X30,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	250	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.6 mm	2.6 mm
Supply Voltage-Max	1.26 V	1.26 V
Supply Voltage-Min	1.14 V	1.14 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	40	30
Width	31 mm	31 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays