LF411CN
vs
LMC6044IM/NOPB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
SOIC
Package Description
DIP,
SOIC-14
Pin Count
8
14
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.004 µA
0.000004 µA
Common-mode Reject Ratio-Min
70 dB
62 dB
Common-mode Reject Ratio-Nom
90 dB
75 dB
Input Offset Voltage-Max
2000 µV
6000 µV
JESD-30 Code
R-PDIP-T8
R-PDSO-G14
JESD-609 Code
e0
e3
Length
9.78 mm
8.65 mm
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
1
4
Number of Terminals
8
14
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
1.75 mm
Slew Rate-Min
8 V/us
0.01 V/us
Slew Rate-Nom
25 V/us
0.02 V/us
Supply Current-Max
3.4 mA
107 mA
Supply Voltage Limit-Max
18 V
16 V
Supply Voltage-Nom (Vsup)
15 V
5 V
Surface Mount
NO
YES
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
8000
100
Voltage Gain-Min
25000
50000
Width
7.62 mm
3.9 mm
Base Number Matches
7
2
Architecture
VOLTAGE-FEEDBACK
Frequency Compensation
YES
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Moisture Sensitivity Level
1
Package Equivalence Code
SOP14,.25
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare LF411CN with alternatives
Compare LMC6044IM/NOPB with alternatives