LF411CN
vs
LM324N/NOPB
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
PLASTIC, DIP-14
Pin Count
8
14
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.004 µA
0.5 µA
Common-mode Reject Ratio-Min
70 dB
65 dB
Common-mode Reject Ratio-Nom
90 dB
85 dB
Input Offset Voltage-Max
2000 µV
9000 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T14
JESD-609 Code
e0
e3
Length
9.78 mm
19.18 mm
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
1
4
Number of Terminals
8
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
5.08 mm
Slew Rate-Min
8 V/us
Slew Rate-Nom
25 V/us
0.5 V/us
Supply Current-Max
3.4 mA
1.2 mA
Supply Voltage Limit-Max
18 V
32 V
Supply Voltage-Nom (Vsup)
15 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
8000
1000
Voltage Gain-Min
25000
25000
Width
7.62 mm
7.62 mm
Base Number Matches
7
3
Architecture
VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C
0.25 µA
Frequency Compensation
YES
Low-Offset
NO
Micropower
YES
Moisture Sensitivity Level
1
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare LF411CN with alternatives
Compare LM324N/NOPB with alternatives