LE75183BSC8 vs LE75183BQC feature comparison

LE75183BSC8 Microsemi Corporation

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LE75183BQC Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code SOIC QFN
Package Description SOP, HVQCCN,
Pin Count 28 32
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G28 S-XQCC-N32
Length 17.9 mm 8 mm
Number of Functions 1 1
Number of Terminals 28 32
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP HVQCCN
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position DUAL QUAD
Width 7.5 mm 8 mm
Base Number Matches 3 3
Pbfree Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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