LE75183BSC8 vs CPC7583BB feature comparison

LE75183BSC8 Zarlink Semiconductor Inc

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CPC7583BB IXYS Integrated Circuits Division

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC IXYS INTEGRATED CIRCUITS DIVISION
Package Description SOP, SOP, SOP28,.4
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Length 17.9 mm 18.034 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.642 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 3 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 28
JESD-609 Code e3
Moisture Sensitivity Level 1
Package Equivalence Code SOP28,.4
Peak Reflow Temperature (Cel) 260
Supply Current-Max 0.0019 mA
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

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