LD87C51BH-24
vs
TS87C52X2-MCJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
ATMEL CORP
Part Package Code
DIP
DIP
Package Description
WDIP,
WDIP,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
24 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-GDIP-T40
R-GDIP-T40
Length
52.325 mm
Number of I/O Lines
32
32
Number of Terminals
40
40
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Qualification Status
Not Qualified
Not Qualified
ROM (words)
4096
8192
ROM Programmability
UVPROM
UVPROM
Seated Height-Max
5.72 mm
5.71 mm
Speed
24 MHz
40 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
ECCN Code
3A991.A.2
Compare LD87C51BH-24 with alternatives
Compare TS87C52X2-MCJ with alternatives