TS87C52X2-MCJ
vs
TP80C32-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
INTEL CORP
Package Description
WINDOWED, CERAMIC, DIP-40
PLASTIC, DIP-40
Reach Compliance Code
unknown
unknown
Has ADC
NO
NO
Address Bus Width
16
16
Bit Size
8
8
Clock Frequency-Max
40 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-GDIP-T40
R-PDIP-T40
Number of I/O Lines
32
32
Number of Terminals
40
40
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
UVPROM
ROM LESS
Speed
40 MHz
16 MHz
Supply Voltage-Max
5.5 V
6 V
Supply Voltage-Min
4.5 V
4 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
40
HTS Code
8542.31.00.01
Additional Feature
BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
Boundary Scan
NO
CPU Family
8051
Format
FIXED POINT
Integrated Cache
NO
Length
52.26 mm
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
1
Number of Timers
3
On Chip Data RAM Width
8
Package Equivalence Code
DIP40,.6
RAM (bytes)
256
RAM (words)
256
ROM (words)
0
Seated Height-Max
5.08 mm
Supply Current-Max
38 mA
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare TP80C32-1 with alternatives