LC87C257-200V10 vs AM27C256-200DCB feature comparison

LC87C257-200V10 Intel Corporation

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AM27C256-200DCB Cypress Semiconductor

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description WDIP,
Pin Count 28
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-CDIP-T28
Length 35.56 mm
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.44 mm
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm
Base Number Matches 1 4

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