LC5256MV-75FN256I vs XCR3256XL-12FTG256I feature comparison

LC5256MV-75FN256I Lattice Semiconductor Corporation

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XCR3256XL-12FTG256I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP XILINX INC
Part Package Code BGA BGA
Package Description LEAD FREE, FPBGA-256 FBGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 141 164
Number of Macro Cells 256 256
Number of Terminals 256 256
Organization 0 DEDICATED INPUTS, 141 I/O 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 260
Programmable Logic Type EE PLD EE PLD
Propagation Delay 9.5 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 2.7 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 17 mm 17 mm
Base Number Matches 1 2
Factory Lead Time 12 Weeks
Clock Frequency-Max 88 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL

Compare LC5256MV-75FN256I with alternatives

Compare XCR3256XL-12FTG256I with alternatives