LAXP2-17E-5FTN256E
vs
LFXP2-17E-7FT256C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Pin Count
256
256
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Lattice Semiconductor
Lattice Semiconductor
Clock Frequency-Max
435 MHz
435 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
17000
Number of Inputs
201
201
Number of Logic Cells
17000
17000
Number of Outputs
201
201
Number of Terminals
256
256
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
17000 GATES
2125 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
1.55 mm
2.1 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
17 mm
17 mm
Base Number Matches
1
1
Package Description
17 X 17 MM, FTBGA-256
Combinatorial Delay of a CLB-Max
0.304 ns
Technology
CMOS
Temperature Grade
OTHER
Compare LAXP2-17E-5FTN256E with alternatives
Compare LFXP2-17E-7FT256C with alternatives