LAN9355I/PT
vs
VSC8486XJB-11
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HTFQFP,
|
FCBGA-144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
7 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PQFP-G80
|
S-PBGA-B144
|
| JESD-609 Code |
e3
|
|
| Length |
12 mm
|
13 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
80
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
LBGA
|
| Package Equivalence Code |
TQFP80,.55SQ
|
BGA144,12X12,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.2 mm
|
1.4 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
12 mm
|
13 mm
|
| Base Number Matches |
1
|
1
|
| Data Rate |
|
|
|
|
|
Compare LAN9355I/PT with alternatives
Compare VSC8486XJB-11 with alternatives