LAN9210-ABZJ
vs
LAN9220-ABZJ
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
STANDARD MICROSYSTEMS CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, QFN-56
|
ROHS COMPLIANT, QFN-56
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
SMSC
|
|
| Address Bus Width |
7
|
7
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| Data Encoding/Decoding Method |
NRZI; BIPH-LEVEL(MANCHESTER)
|
NRZI; BIPH-LEVEL(MANCHESTER)
|
| Data Transfer Rate-Max |
12.5 MBps
|
12.5 MBps
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-XQCC-N56
|
S-XQCC-N56
|
| Length |
8 mm
|
8 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
1.9 V
|
|
| Supply Voltage-Min |
1.7 V
|
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8 mm
|
8 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LAN9210-ABZJ with alternatives
Compare LAN9220-ABZJ with alternatives