LAN88730AMR-C-V01
vs
VSC8664XIC
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HVQCCN,
|
BGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
100000 Mbps
|
|
| JESD-30 Code |
S-PQCC-N32
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
256
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
BGA
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
0.9 mm
|
2 mm
|
| Supply Current-Max |
28.5 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
5 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare LAN88730AMR-C-V01 with alternatives
Compare VSC8664XIC with alternatives