LAN88730AMR-C-V01
vs
AQR107-B0-EG-Y
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
AQUANTIA CORP
|
Package Description |
HVQCCN,
|
LFBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Data Rate |
100000 Mbps
|
|
JESD-30 Code |
S-PQCC-N32
|
R-PBGA-B104
|
JESD-609 Code |
e3
|
|
Length |
5 mm
|
11 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
104
|
Number of Transceivers |
1
|
|
Operating Temperature-Max |
85 °C
|
108 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
LFBGA
|
Package Equivalence Code |
LCC32,.2SQ,20
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
0.9 mm
|
1.57 mm
|
Supply Current-Max |
28.5 mA
|
|
Supply Voltage-Nom |
3.3 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
5 mm
|
7 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare LAN88730AMR-C-V01 with alternatives
Compare AQR107-B0-EG-Y with alternatives