Findchips: Compare L8C203KC50 vs 5962-8956704ZC

L8C203KC50 vs 5962-8956704ZC feature comparison

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Rohs Code	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	LOGIC DEVICES INC	TEMIC SEMICONDUCTORS
Part Package Code	QFJ
Package Description	QCCN,
Pin Count	32
Reach Compliance Code	unknown	unknown
ECCN Code	EAR99
HTS Code	8542.32.00.71
Access Time-Max	50 ns	50 ns
Additional Feature	RETRANSMIT	RETRANSMIT
Cycle Time	65 ns	65 ns
JESD-30 Code	R-CQCC-N32
Length	14 mm	13.97 mm
Memory Density	18432 bit	18432 bit
Memory IC Type	OTHER FIFO
Memory Width	9	9
Moisture Sensitivity Level	3
Number of Functions	1	1
Number of Terminals	32
Number of Words	2048 words	2048 words
Number of Words Code	2000	2000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	70 °C	125 °C
Operating Temperature-Min		-55 °C
Organization	2KX9	2KX9
Output Characteristics	3-STATE
Output Enable	NO	NO
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	QCCN	QCCN
Package Shape	RECTANGULAR
Package Style	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Cel)	225
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.048 mm	3.048 mm
Supply Current-Max	0.08 mA
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	MILITARY
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	QUAD	QUAD
Width	11.43 mm	11.43 mm
Base Number Matches	1	3
JESD-609 Code		e4
Terminal Finish		GOLD
	Memory » FIFOs	Memory » FIFOs