5962-8956704ZC
vs
L8C203KM50
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
LOGIC DEVICES INC
Reach Compliance Code
unknown
unknown
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
65 ns
65 ns
JESD-609 Code
e4
Length
13.97 mm
14 mm
Memory Density
18432 bit
18432 bit
Memory Width
9
9
Number of Functions
1
1
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX9
2KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
3.048 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
3
1
Rohs Code
Part Package Code
QFJ
Package Description
QCCN,
Pin Count
32
ECCN Code
EAR99
HTS Code
8542.32.00.71
JESD-30 Code
R-CQCC-N32
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Number of Terminals
32
Output Characteristics
3-STATE
Package Shape
RECTANGULAR
Peak Reflow Temperature (Cel)
225
Supply Current-Max
0.08 mA
Compare 5962-8956704ZC with alternatives
Compare L8C203KM50 with alternatives