L8C200CMB25 vs 7200L25TP feature comparison

L8C200CMB25 LOGIC Devices Inc

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7200L25TP Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP PDIP
Package Description DIP, PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 25 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 35 ns 35 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
Length 36.83 mm 34.671 mm
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 256X9 256X9
Output Characteristics 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.572 mm
Supply Current-Max 0.09 mA 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Manufacturer Package Code PT28
Clock Frequency-Max (fCLK) 28.5 MHz
JESD-609 Code e0
Package Equivalence Code DIP28,.3
Standby Current-Max 0.0005 A
Terminal Finish TIN LEAD

Compare L8C200CMB25 with alternatives

Compare 7200L25TP with alternatives