L80227 vs TLE6250GV33XUMA1 feature comparison

L80227 LSI Corporation

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TLE6250GV33XUMA1 Infineon Technologies AG

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Rohs Code No Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer LSI CORP INFINEON TECHNOLOGIES AG
Part Package Code QFP SOIC
Package Description LFQFP, QFP64,.47SQ,20 SOP,
Pin Count 64 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Data Rate 100000 Mbps
JESD-30 Code S-PQFP-G64 R-PDSO-G8
JESD-609 Code e0 e3
Length 10 mm 5 mm
Number of Functions 1 1
Number of Terminals 64 8
Number of Transceivers 2
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP SOP
Package Equivalence Code QFP64,.47SQ,20
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.75 mm
Supply Current-Max 0.14 mA
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Telecom IC Type ETHERNET TRANSCEIVER CAN TRANSCEIVER
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 4 mm
Base Number Matches 3 1
Pbfree Code Yes
Samacsys Manufacturer Infineon
Moisture Sensitivity Level 3

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Compare TLE6250GV33XUMA1 with alternatives