L7C197DME25 vs L7C197CME25 feature comparison

L7C197DME25 LOGIC Devices Inc

Buy Now Datasheet

L7C197CME25 LOGIC Devices Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC LOGIC DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP24,.3
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
Additional Feature AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN
JESD-30 Code R-CDIP-T24 R-GDIP-T24
Length 30.48 mm 31.75 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 24 24
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.953 mm 5.08 mm
Standby Voltage-Min 2 V 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
I/O Type SEPARATE
JESD-609 Code e0
Package Equivalence Code DIP24,.3
Screening Level MIL-STD-883 Class B (Modified)
Standby Current-Max 0.005 A
Supply Current-Max 0.09 mA
Terminal Finish TIN LEAD

Compare L7C197DME25 with alternatives

Compare L7C197CME25 with alternatives