L7C168DC35
vs
HY61C68T35
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
SK HYNIX INC
Part Package Code
DIP
Package Description
DIP, DIP20,.3
DIP, DIP20,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDIP-T20
R-XDIP-T20
JESD-609 Code
e0
e0
Length
25.4 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
1
Number of Terminals
20
20
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4KX4
4KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.953 mm
Standby Voltage-Min
2 V
4.5 V
Supply Current-Max
0.05 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Compare L7C168DC35 with alternatives
Compare HY61C68T35 with alternatives