HY61C68T35
vs
5962-8670519ZA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SK HYNIX INC
PYRAMID SEMICONDUCTOR CORP
Package Description
DIP, DIP20,.3
DFP-20
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
I/O Type
COMMON
JESD-30 Code
R-XDIP-T20
R-CDFP-F20
JESD-609 Code
e0
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Terminals
20
20
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX4
4KX4
Output Characteristics
3-STATE
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
4.5 V
Supply Current-Max
0.06 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Number of Functions
1
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Compare HY61C68T35 with alternatives
Compare 5962-8670519ZA with alternatives