L6924D
vs
MCP73861T-I/SL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
3 X 3 MM, VFQFPN-16
|
0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
VFQFPN
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
Microchip
|
| Adjustable Threshold |
YES
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
LINEAR BATTERY CHARGER
|
| JESD-30 Code |
S-XQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
9.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
SOP16,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Current-Max (Isup) |
2.5 mA
|
4 mA
|
| Supply Voltage-Max (Vsup) |
12 V
|
12 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare L6924D with alternatives
Compare MCP73861T-I/SL with alternatives