L6202 vs L6201 feature comparison

L6202 STMicroelectronics

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L6201 STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP SOIC
Package Description POWER, DIP-18 SOP-20
Pin Count 18 20
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics STMicroelectronics
Built-in Protections THERMAL TRANSIENT; THERMAL
Input Characteristics STANDARD STANDARD
Interface IC Type FULL BRIDGE BASED PERIPHERAL DRIVER FULL BRIDGE BASED PERIPHERAL DRIVER
JESD-30 Code R-PDIP-T18 R-PDSO-G20
JESD-609 Code e3 e4
Number of Functions 1 1
Number of Terminals 18 20
Output Characteristics TOTEM-POLE TOTEM-POLE
Output Current Flow Direction SOURCE AND SINK SOURCE AND SINK
Output Peak Current Limit-Nom 5 A 5 A
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 2.65 mm
Supply Voltage-Max 48 V 48 V
Supply Voltage-Min 12 V 12 V
Supply Voltage-Nom 36 V 36 V
Surface Mount NO YES
Technology BCDMOS BCDMOS
Terminal Finish MATTE TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
Base Number Matches 3 8
Factory Lead Time 25 Weeks
Length 12.8 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30