L103S272LF
vs
L103S272AP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
BI TECHNOLOGIES CORP
|
TT ELECTRONICS PLC
|
Package Description |
SIP,
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8533.21.00.50
|
|
Construction |
Rectangular
|
Conformal Coated
|
Element Power Dissipation |
0.2 W
|
|
First Element Resistance |
2700 Ω
|
|
JESD-609 Code |
e1
|
|
Lead Length |
3.56 mm
|
3.556 mm
|
Mounting Feature |
THROUGH HOLE MOUNT
|
|
Network Type |
ISOLATED
|
ISOLATED
|
Number of Elements |
1
|
|
Number of Functions |
5
|
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
5.08 mm
|
4.95 mm
|
Package Length |
25.4 mm
|
25.4 mm
|
Package Shape |
RECTANGULAR PACKAGE
|
|
Package Style |
SIP
|
SIP
|
Package Width |
2.5 mm
|
2.41 mm
|
Packing Method |
Bulk
|
Ammo Pack
|
Rated Power Dissipation (P) |
0.2 W
|
0.2 W
|
Rated Temperature |
70 °C
|
|
Resistance |
2700 Ω
|
2700 Ω
|
Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
Second/Last Element Resistance |
2700 Ω
|
|
Surface Mount |
NO
|
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Temperature Coefficient Tracking |
50 ppm/°C
|
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Shape |
FLAT
|
|
Tolerance |
2%
|
2%
|
Working Voltage |
100 V
|
100 V
|
Base Number Matches |
1
|
1
|
Lead Spacing |
|
2.54 mm
|
|
|
|
Compare L103S272LF with alternatives
Compare L103S272AP with alternatives