KU8230920
vs
KD82309SX16
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
QFP
QFP
Package Description
PLASTIC, QFP-100
BQFP,
Pin Count
100
100
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
11
11
Boundary Scan
NO
NO
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e0
Length
19.05 mm
19.05 mm
Low Power Mode
NO
NO
Number of Banks
4
4
Number of Terminals
100
100
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BQFP
BQFP
Package Equivalence Code
SPQFP100,.9SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, BUMPER
FLATPACK, BUMPER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
4.572 mm
Supply Current-Max
180 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CHMOS
CHMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Width
19.05 mm
19.05 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
1
1
Compare KU8230920 with alternatives
Compare KD82309SX16 with alternatives