KU8230920
vs
V380SDC-75A0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
V3 SEMICONDUCTOR
Part Package Code
QFP
QFP
Package Description
PLASTIC, QFP-100
QFP,
Pin Count
100
100
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
11
Boundary Scan
NO
External Data Bus Width
8
JESD-30 Code
S-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
Length
19.05 mm
Low Power Mode
NO
Number of Banks
4
Number of Terminals
100
100
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BQFP
QFP
Package Equivalence Code
SPQFP100,.9SQ
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, BUMPER
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
Supply Current-Max
180 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
Surface Mount
YES
YES
Technology
CHMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
Terminal Position
QUAD
QUAD
Width
19.05 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
1
1
Pbfree Code
Compare KU8230920 with alternatives
Compare V380SDC-75A0 with alternatives