KU80C188EC-25
vs
KU80C188EC25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
QFP
QFP
Package Description
QFP, SPQFP100,.9SQ
QFP, SPQFP100,.9SQ
Pin Count
100
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
20
20
Bit Size
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
8
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e0
e0
Length
19.05 mm
19.05 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of DMA Channels
4
Number of External Interrupts
9
Number of Serial I/Os
2
Number of Terminals
100
100
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
SPQFP100,.9SQ
SPQFP100,.9SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.57 mm
4.57 mm
Speed
25 MHz
25 MHz
Supply Current-Max
125 mA
125 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Width
19.05 mm
19.05 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
3
Peak Reflow Temperature (Cel)
220
Power Supplies
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare KU80C188EC-25 with alternatives
Compare KU80C188EC25 with alternatives