KSZ8895MLI
vs
KSZ9893RNXI-TR
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
LFQFP,
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G128
|
S-PQCC-N64
|
Length |
14 mm
|
8 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
1.6 mm
|
0.9 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
7 Weeks
|
Date Of Intro |
|
2018-02-16
|
Samacsys Manufacturer |
|
Microchip
|
JESD-609 Code |
|
e3
|
Package Equivalence Code |
|
LCC64,.32SQ,16
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare KSZ8895MLI with alternatives
Compare KSZ9893RNXI-TR with alternatives