KSZ8563RNXV
vs
BCM53124SIMML
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
BROADCOM INC
|
| Package Description |
HVQCCN,
|
HVBCC,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
6 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-XBCC-B186
|
| JESD-609 Code |
e3
|
|
| Length |
8 mm
|
12 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
186
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-45 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVBCC
|
| Package Equivalence Code |
LCC64,.32SQ,16
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.9 mm
|
0.85 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
NO LEAD
|
BUTT
|
| Terminal Pitch |
0.4 mm
|
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
8 mm
|
12 mm
|
| Base Number Matches |
1
|
1
|
| Technology |
|
CMOS
|
|
|
|
Compare KSZ8563RNXV with alternatives
Compare BCM53124SIMML with alternatives