KMM374S413DTS-GH vs MT16LD464G-6XS feature comparison

KMM374S413DTS-GH Samsung Semiconductor

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MT16LD464G-6XS Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Package Description , DIMM-168
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.24
Access Mode DUAL BANK PAGE BURST FAST PAGE WITH EDO
Access Time-Max 6 ns 60 ns
Additional Feature AUTO/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM MODULE EDO DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX64 4MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Part Package Code DIMM
Pin Count 168
Alternate Memory Width 32
I/O Type COMMON
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Code DIMM
Package Equivalence Code DIMM168
Refresh Cycles 2048
Seated Height-Max 25.654 mm
Standby Current-Max 0.0024 A
Supply Current-Max 1.92 mA
Terminal Pitch 1.27 mm

Compare KMM374S413DTS-GH with alternatives

Compare MT16LD464G-6XS with alternatives