KM93C06 vs M93C06-WBN5 feature comparison

KM93C06 Samsung Semiconductor

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M93C06-WBN5 STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 PLASTIC, SDIP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS CONFIGURABLE AS 16 X 16
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
Data Retention Time-Min 10 40
Endurance 100000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 9.185 mm 9.55 mm
Memory Density 256 bit 256 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -20 °C
Organization 16X16 16X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.55 mm 5.9 mm
Serial Bus Type MICROWIRE MICROWIRE
Standby Current-Max 0.0001 A 0.00001 A
Supply Current-Max 0.003 mA 0.0015 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 30 ms 10 ms
Write Protection SOFTWARE SOFTWARE
Base Number Matches 1 1
Alternate Memory Width 8

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Compare M93C06-WBN5 with alternatives