KM93C06
vs
M93C06-WBN5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
PLASTIC, SDIP-8
Pin Count
8
8
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS
CONFIGURABLE AS 16 X 16
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
Data Retention Time-Min
10
40
Endurance
100000 Write/Erase Cycles
1000000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e0
Length
9.185 mm
9.55 mm
Memory Density
256 bit
256 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-20 °C
Organization
16X16
16X16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.55 mm
5.9 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Standby Current-Max
0.0001 A
0.00001 A
Supply Current-Max
0.003 mA
0.0015 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
30 ms
10 ms
Write Protection
SOFTWARE
SOFTWARE
Base Number Matches
1
1
Alternate Memory Width
8
Compare KM93C06 with alternatives
Compare M93C06-WBN5 with alternatives