KM75C104ANI-50
vs
CL1I-67204L-55
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
ATMEL CORP
|
| Package Description |
DIP, DIP28,.3
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
50 ns
|
30 ns
|
| JESD-30 Code |
R-PDIP-T28
|
R-GDIP-T28
|
| JESD-609 Code |
e0
|
|
| Memory Density |
36864 bit
|
73728 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
9
|
9
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
28
|
28
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
4KX9
|
8KX9
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.005 A
|
|
| Supply Current-Max |
0.06 mA
|
0.15 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
28
|
| Cycle Time |
|
40 ns
|
| Length |
|
37.25 mm
|
| Number of Functions |
|
1
|
| Output Enable |
|
NO
|
| Parallel/Serial |
|
PARALLEL
|
| Seated Height-Max |
|
5.72 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Width |
|
15.24 mm
|
|
|
|
Compare KM75C104ANI-50 with alternatives
Compare CL1I-67204L-55 with alternatives