CL1I-67204L-55
vs
ML1I-67204L-55/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
ATMEL CORP
Package Description
0.600 INCH, CERAMIC, DIP-28
DIP,
Reach Compliance Code
unknown
unknown
Access Time-Max
55 ns
35 ns
Cycle Time
70 ns
45 ns
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Memory Density
36864 bit
9216 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
4096 words
4096 words
Number of Words Code
4000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX9
1KX9
Output Enable
NO
YES
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
Part Package Code
DIP
Pin Count
28
ECCN Code
EAR99
HTS Code
8542.32.00.71
Length
37.25 mm
Memory IC Type
OTHER FIFO
Seated Height-Max
5.72 mm
Supply Current-Max
0.12 mA
Terminal Pitch
2.54 mm
Width
15.24 mm
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