KM6264BLP-7 vs MT5C2564EC-35AT feature comparison

KM6264BLP-7 Samsung Semiconductor

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MT5C2564EC-35AT Micron Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-PQCC-N28
JESD-609 Code e0 e0
Length 36.32 mm
Memory Density 65536 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 4
Number of Functions 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 8192 words 65536 words
Number of Words Code 8000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 8KX8 64KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCN
Package Equivalence Code DIP28,.6 LCC28,.35X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.00005 A 0.008 A
Standby Voltage-Min 2 V 4.5 V
Supply Current-Max 0.045 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm
Base Number Matches 1 1

Compare KM6264BLP-7 with alternatives

Compare MT5C2564EC-35AT with alternatives