KM6264BLP-7 vs 5962-9318714H4A feature comparison

KM6264BLP-7 Samsung Semiconductor

Buy Now Datasheet

5962-9318714H4A Cobham Advanced Electronic Solutions

Buy Now
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 S-XPGA-P66
JESD-609 Code e0
Length 36.32 mm
Memory Density 65536 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1
Number of Ports 1
Number of Terminals 28 66
Number of Words 8192 words 131072 words
Number of Words Code 8000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 128KX32
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP PGA
Package Equivalence Code DIP28,.6 PGA66,11X11
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.00005 A 0.005 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.045 mA 0.52 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Width 15.24 mm
Base Number Matches 1 7
Screening Level 38535Q/M;38534H;883B

Compare KM6264BLP-7 with alternatives

Compare 5962-9318714H4A with alternatives