KM616FS1010AFI-7 vs IDT71V016HSA10PHG8 feature comparison

KM616FS1010AFI-7 Samsung Semiconductor

Buy Now Datasheet

IDT71V016HSA10PHG8 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA TSOP2
Package Description TFBGA, BGA48,6X8,30 0.400 INCH, ROHS COMPLIANT, TSOP2-44
Pin Count 48 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 10 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e0 e3
Length 7 mm 18.41 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP2
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Voltage-Min 1 V
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 2.7 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 3.15 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Width 6 mm 10.16 mm
Base Number Matches 1 1
Pbfree Code Yes
Additional Feature ALSO OPERATES WITH 3V TO 3.6 V SUPPLY
Moisture Sensitivity Level 3

Compare KM616FS1010AFI-7 with alternatives

Compare IDT71V016HSA10PHG8 with alternatives