KM23V8100D-10 vs M27C800-50XF1 feature comparison

KM23V8100D-10 Samsung Semiconductor

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M27C800-50XF1 STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, WINDOWED, FRIT SEALED, CERAMIC, DIP-42
Pin Count 42 42
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 100 ns 50 ns
Additional Feature CONFIGURABLE AS 512K X 16
Alternate Memory Width 8 8
JESD-30 Code R-PDIP-T42 R-GDIP-T42
Length 52.42 mm 54.635 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.97 mm
Supply Current-Max 0.03 mA 0.07 mA
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Rohs Code Yes
I/O Type COMMON
JESD-609 Code e3
Output Characteristics 3-STATE
Package Equivalence Code DIP42,.6
Standby Current-Max 0.00005 A
Terminal Finish MATTE TIN

Compare KM23V8100D-10 with alternatives

Compare M27C800-50XF1 with alternatives