KM23V8100B-15 vs AM27C800-150/BXA feature comparison

KM23V8100B-15 Samsung Semiconductor

Buy Now Datasheet

AM27C800-150/BXA AMD

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP42,.6 WDIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 150 ns 150 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDIP-T42 R-GDIP-T42
JESD-609 Code e0 e0
Length 52.43 mm 54.864 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Equivalence Code DIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.588 mm
Standby Current-Max 0.00005 A 0.0001 A
Supply Current-Max 0.03 mA 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
I/O Type COMMON
Screening Level 38535Q/M;38534H;883B

Compare KM23V8100B-15 with alternatives

Compare AM27C800-150/BXA with alternatives