KM23V4100B-25
vs
MSM534022CRS
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
OKI ELECTRIC INDUSTRY CO LTD
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP40,.6
|
DIP,
|
Pin Count |
40
|
40
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
250 ns
|
100 ns
|
Alternate Memory Width |
8
|
8
|
JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
JESD-609 Code |
e0
|
|
Length |
52.43 mm
|
51.98 mm
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
MASK ROM
|
MASK ROM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
40
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
256K16
|
256K16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Standby Current-Max |
0.00005 A
|
|
Supply Current-Max |
0.03 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare KM23V4100B-25 with alternatives
Compare MSM534022CRS with alternatives