KM23V16005DG-10
vs
MR53V1652J-XXMA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
LAPIS SEMICONDUCTOR CO LTD
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
SOP, SOP44,.63
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
100 ns
|
150 ns
|
| Additional Feature |
CAN ALSO BE OPERATED IN 3V TO 3.6V
|
|
| Alternate Memory Width |
8
|
8
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| Length |
28.5 mm
|
|
| Memory Density |
16777216 bit
|
4194304 bit
|
| Memory IC Type |
MASK ROM
|
MASK ROM
|
| Memory Width |
16
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1MX16
|
512KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.1 mm
|
|
| Supply Current-Max |
0.06 mA
|
0.015 mA
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
12.6 mm
|
|
| Base Number Matches |
1
|
2
|
| Package Equivalence Code |
|
SOP44,.63
|
| Standby Current-Max |
|
0.00001 A
|
|
|
|
Compare KM23V16005DG-10 with alternatives
Compare MR53V1652J-XXMA with alternatives