KM23V128005TY-12
vs
UPD23C128040BLGY-XXX-MJH
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
NEC ELECTRONICS CORP
Part Package Code
TSOP1
TSOP1
Package Description
TSOP1,
12 X 18 MM, PLASTIC, TSOP1-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
120 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
16.4 mm
16.4 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
0.08 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.3 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
12 mm
12 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare KM23V128005TY-12 with alternatives
Compare UPD23C128040BLGY-XXX-MJH with alternatives