KM23C8100D-12 vs M27V800-120B1 feature comparison

KM23C8100D-12 Samsung Semiconductor

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M27V800-120B1 STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP42,.6 0.600 INCH, PLASTIC, DIP-42
Pin Count 42 42
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 120 ns
Additional Feature CONFIGURABLE AS 512K X 16 CONFIGURABLE AS 512K X 16
Alternate Memory Width 8 8
JESD-30 Code R-PDIP-T42 R-PDIP-T42
JESD-609 Code e0 e0
Length 52.42 mm 52.455 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM OTP ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Standby Current-Max 0.00005 A 0.00002 A
Supply Current-Max 0.05 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 3.63 V
Supply Voltage-Min (Vsup) 4.5 V 2.97 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE

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Compare M27V800-120B1 with alternatives