KM23C8100BG-10 vs LH538600N-10 feature comparison

KM23C8100BG-10 Samsung Semiconductor

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LH538600N-10 Sharp Corp

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SHARP CORP
Part Package Code SOIC
Package Description SOP, SOP44,.63 0.600 INCH, PLASTIC, SOP-44
Pin Count 44
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0
Length 28.5 mm 28.2 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP44,.63
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.1 mm 3.25 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.06 mA 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 12.6 mm 13.2 mm
Base Number Matches 1 1

Compare KM23C8100BG-10 with alternatives

Compare LH538600N-10 with alternatives