KM23C8000G-15 vs TC538000AF feature comparison

KM23C8000G-15 Samsung Semiconductor

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TC538000AF Toshiba America Electronic Components

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP32,.56 0.525 INCH, PLASTIC, SOP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 150 ns 150 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0 e0
Length 20.47 mm 20.6 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 2.8 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 11.43 mm 10.7 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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