KM23C64000G-15 vs MR27T6402G-XXXTP feature comparison

KM23C64000G-15 Samsung Semiconductor

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MR27T6402G-XXXTP LAPIS Semiconductor Co Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC LAPIS SEMICONDUCTOR CO LTD
Part Package Code SOIC TSOP2
Package Description SOP, SOP44,.63 TSOP2, TSOP44,.46,32
Pin Count 44 44
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 90 ns
Additional Feature CONFIGURABLE AS 4M X 16
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0
Length 28.5 mm 18.41 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Equivalence Code SOP44,.63 TSOP44,.46,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.1 mm 1.2 mm
Standby Current-Max 0.00005 A 0.00001 A
Supply Current-Max 0.05 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position DUAL DUAL
Width 12.6 mm 10.16 mm
Base Number Matches 1 2

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Compare MR27T6402G-XXXTP with alternatives