KM23C4100HFP1-12 vs XC18V512VQ44C0901 feature comparison

KM23C4100HFP1-12 Samsung Semiconductor

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XC18V512VQ44C0901 AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC XILINX INC
Part Package Code QFP QFP
Package Description WQFP, QFP44,.7SQ,32 TQFP,
Pin Count 44 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A991.B.1.B.2
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 120 ns 15 ns
Alternate Memory Width 16
JESD-30 Code S-CQFP-G44 S-PQFP-G44
JESD-609 Code e0 e0
Length 14 mm 10 mm
Memory Density 4194304 bit 524288 bit
Memory IC Type MASK ROM CONFIGURATION MEMORY
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 65536 words
Number of Words Code 512000 64000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code WQFP TQFP
Package Equivalence Code QFP44,.7SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, WINDOW FLATPACK, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL/SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 1.2 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 14 mm 10 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3

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