KM23C4100AFP2-15 vs LH532000BZ-15 feature comparison

KM23C4100AFP2-15 Samsung Semiconductor

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LH532000BZ-15 Sharp Corp

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SHARP CORP
Part Package Code QFP
Package Description WQFP, TQFP44,.6SQ,32 10 X 10 MM, PLASTIC, QFP-44
Pin Count 44
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 150 ns 150 ns
Alternate Memory Width 16 16
JESD-30 Code S-CQFP-G44 S-PQFP-G44
JESD-609 Code e0 e0
Length 10 mm 10 mm
Memory Density 4194304 bit 2097152 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 256KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code WQFP QFP
Package Equivalence Code TQFP44,.6SQ,32 QFP44,.5SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, WINDOW FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00005 A 0.0001 A
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
Base Number Matches 1 1
Seated Height-Max 1.85 mm

Compare KM23C4100AFP2-15 with alternatives

Compare LH532000BZ-15 with alternatives