KM23C4100AFP1-20 vs HN62434TFP-20 feature comparison

KM23C4100AFP1-20 Samsung Semiconductor

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HN62434TFP-20 Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC RENESAS TECHNOLOGY CORP
Part Package Code QFP QFP
Package Description WQFP, QFP44,.7SQ,32 TQFP,
Pin Count 44 44
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 200 ns 200 ns
Alternate Memory Width 8 16
JESD-30 Code S-CQFP-G44 S-PQFP-G44
JESD-609 Code e0
Length 14 mm 14 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 262144 words 524288 words
Number of Words Code 256000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256K16 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code WQFP TQFP
Package Equivalence Code QFP44,.7SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, WINDOW FLATPACK, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 1.1 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 1

Compare KM23C4100AFP1-20 with alternatives

Compare HN62434TFP-20 with alternatives