KM23C32000CG
vs
MX23C3211MC-15
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MACRONIX INTERNATIONAL CO LTD
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
44
44
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
200 ns
Additional Feature
USER CONFIGURABLE AS 2M X 16
WITH PAGE MODE FUNCTION; PAGE MODE ACCESS TIME = 70NS
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
28.5 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
4194304 words
2097152 words
Number of Words Code
4000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4MX8
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.1 mm
3 mm
Supply Current-Max
0.05 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
12.6 mm
12.6 mm
Base Number Matches
1
1
Alternate Memory Width
8
JESD-609 Code
e0
Output Characteristics
3-STATE
Terminal Finish
TIN LEAD
Compare KM23C32000CG with alternatives
Compare MX23C3211MC-15 with alternatives