KM23C2100H-12 vs AM27C2048-55PI5 feature comparison

KM23C2100H-12 Samsung Semiconductor

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AM27C2048-55PI5 Spansion

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SPANSION INC
Part Package Code DIP DIP
Package Description DIP, DIP40,.6 DIP,
Pin Count 40 40
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 200 ns
Alternate Memory Width 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e0
Length 52.43 mm 52.32 mm
Memory Density 2097152 bit 524288 bit
Memory IC Type MASK ROM OTP ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 131072 words 131072 words
Number of Words Code 128000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX16 64KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.715 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1

Compare KM23C2100H-12 with alternatives

Compare AM27C2048-55PI5 with alternatives